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Pulse-electroplating Vertical Continuous Plating Machine

Description

Key Properties

  • (Optional) self-inspective
    flight bar clamp current device.
  • Automatic pumping device for copper plating residue.
  • Copper tank is equipped with steel wire rope.
    Alarm starts when flight bar jiggles.

Documentation

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Pulse-electroplating Vertical Continuous Plating Machine

Description

Key Properties

  • (Optional) Self-inspective
    flight bar clamp current device.
  • Automatic pumping device.
    for copper plating residue
  • Copper tank is equipped with steel wire rope. Alarm starts when flight bar jiggles.

Documentation

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Non-contacting Automatic Precision Vertical Continuous Plating Machine

Description

Key Properties

  • Ensure panel flatness and reduce edge effect.
  • Distance between spray and panel surface is consistent, direct flow onto the panel.
  • Achieve handling super thin panel, great spray-rate effect, and satisfy the highly difficult hole-filling product request.
  • No obstruction, no guide strip, no scratch, easier repair and maintenance.

Documentation

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SES (Strip Etch Strip) Line

Description

Key Properties

  • The machine body utilizes Fire Retardant PP material,
    which is high-temperature resistant, fireproof, and safe.
  • Filter out 98% film residue.
  • Reduce the film residue weight efficiently,
    cut down the cost of hazardous waste treatment.

Documentation

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InduBond® RFX

Description

Key Properties

  • Bonding heads press & heat via thermal energy transfer to bond predetermined welding zones until the inner layer, prepreg & resin is fused and cured.
  • Weld zones have no thickness, flat and will not impact flow and fill of resin with no impact to coupons.
  • Bonded zones can withstand dilation and shrinkage of a hot press cycles upto 850 F per the InduBond® X-press.
  • Heads can move in any X or Y direction to bond around or within the panels real estate per the uploaded Gerber file.
  • Effective at bonding all standard material and High Tg targets too including halogen free chemistries.