EQUIPMENT
We sell Equipment that supports ALL Chemical Suppliers.
About EQUIPMENT
We offer a vast variety of cutting-edge equipment for the printed circuit board industry worldwide.
Our highly skilled technicians professionally install all equipment and provide continuous support with maintenance.
DES (Develop Etch Strip) Line
UCE® is devoted to innovating cutting edge technology of PCB wet-processing equipment to meet the requirements of industry development.
SES (Strip Etch Strip) Line
After the PCB/FPC Film Stripping, the water content of the film residue is high. Applying UCE filter design in the film. Stripping can effectively reduce the cost of film residue treatment.
VCP (Vertical Continuous Plating) Line
Application: First Plating, Full Panel Plating, Pattern Plating, Via Fill Plating, Half Via Fill Plating.
Application: Full Panel Plating, Pattern Plating, Copper Plating.
Application: First Plating, Full Panel Plating, Pattern Plating, Via Fill Plating, Half Via Fill Plating.
InduBond® Lamination & Registration Systems
A high temperature induction lamination press capable of fusion bonding, up to 850°F. Achieves a consistent rate of rise up to 40°F per min on low layer counts and holds less than 2°F panel temperature variance within the press stack. The thermal energy is transferred directly on to the laminates enhancing flow and fill rates. In conjunction with supporting programable cycles, which combined use less than 50KW/h.
A single head induction bonding system which incorporates a manual multi-line tooling plate with either round and/or slotted pins for pinless lamination. Can support either Rigid or Rigid-flex designs, panel registration with an x-ray viewer can be used prior to lamination to support image scaling factors and validation.
An induction bonding Pin registration system with 4 heads which can bond targets around the perimeter of the panel supporting Rigid designs. Has a single draw layup function and incorporated tooling plate for registration activities using round and/or slotted pins. System supports pinless lamination which improves panel planarity by reducing warpage, also increases hit rate for laser drilling whilst supporting better tooling hole geometry.
An induction bonding Pin registration system with 4 heads which can bond targets around the perimeter of the panel supporting Rigid designs. Has a double draw layup function and incorporated tooling plate allowing for sequential registration activities using round and/or slotted pins. System supports pinless lamination which improves panel planarity by reducing warpage, also increases hit rate for laser drilling whilst supporting better tooling hole geometry.
Pin registration system with 4 independent heads to bond any locations in and around the perimeter of the panel, supporting Flex and Rigid-Flex designs. System supports pinless lamination which improves panel planarity by reducing warpage, also increases hit rate for laser drilling whilst supporting better tooling hole geometry. Panel registration with an x-ray viewer can be used prior to lamination to support image scaling factors and validation.